Through-wafer copper electroplating for three-dimensional interconnects
Journal Article
(2002)
Author(s)
NT Nguyen (TU Delft - Electronic Components, Technology and Materials)
E Boellaard (TU Delft - Electronic Components, Technology and Materials)
NP Pham (TU Delft - Electronic Components, Technology and Materials)
VG Kutchoukov (TU Delft - Electronic Instrumentation)
G Craciun (TU Delft - Electronic Instrumentation)
Lina Sarro (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:40bb7272-f834-4ea7-8156-ac455a8dcdc8
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Publication Year
2002
Research Group
Electronic Components, Technology and Materials
Volume number
12
Pages (from-to)
395-399
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