Through-wafer copper electroplating for RF silicon technology

Conference paper (2002)

Authors

NT Nguyen Electronic Components, Technology and Materials -

TK Ng Old - EWI Ch. Integrated Sensing Devices

E Boellaard Electronic Components, Technology and Materials -

NP Pham Electronic Components, Technology and Materials -

G Craciun Electronic Instrumentation -

Pasqualina M Sarro Electronic Components, Technology and Materials -

JN Burghartz Old - EWI Ch. Integrated Sensing Devices

Research Group

Electronic Components, Technology and Materials () (TU Delft)

More Info

expand_more

To reference this document use:

http://resolver.tudelft.nl/uuid:7baeeee6-2ea6-4dd7-a1ab-cccb74af63ba

Published Date

2002

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials