Through-wafer copper electroplating for RF silicon technology

NT Nguyen (TU Delft - Electronic Components, Technology and Materials)

TK Ng (TU Delft - Old - EWI Ch. Integrated Sensing Devices)

E Boellaard (TU Delft - Electronic Components, Technology and Materials)

NP Pham (TU Delft - Electronic Components, Technology and Materials)

G Craciun (TU Delft - Electronic Instrumentation)

Lina P.M. Sarro (TU Delft - Electronic Components, Technology and Materials)

JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)