High aspect ratio through-wafer interconnections for 3D-microsystems

Conference paper (2003)

Authors

L Wang Electronic Components, Technology and Materials -

A Nichelatti Electronic Components, Technology and Materials -

H. Schellevis Electronic Components, Technology and Materials -

C.R. de Boer Electronic Components, Technology and Materials -

C.C.G. Visser Electronic Components, Technology and Materials -

NT Nguyen Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

Elektrotechniek Techniek

To reference this document use:

http://resolver.tudelft.nl/uuid:57b176af-5417-4db8-9705-2919b099224e

More Info

expand_more

Published Date

2003

Language

Undefined/Unknown

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials