High aspect ratio through-wafer interconnections for 3D-microsystems

L Wang (TU Delft - Electronic Components, Technology and Materials)

A Nichelatti (TU Delft - Electronic Components, Technology and Materials)

H Schellevis (TU Delft - Electronic Components, Technology and Materials)

C.R. De Boer (TU Delft - Electronic Components, Technology and Materials)

CCG Visser (TU Delft - Electronic Components, Technology and Materials)

NT Nguyen (TU Delft - Electronic Components, Technology and Materials)

PM Sarro (TU Delft - Electronic Components, Technology and Materials)