Micro-patterning of self-supporting layers with conducting polymer wires for 3D-chip interconnecting applications
Journal Article
(2003)
Author(s)
J Ackermann (External organisation)
C Videlot (External organisation)
NT Nguyen (TU Delft - Electronic Components, Technology and Materials)
L Wang (TU Delft - Electronic Components, Technology and Materials)
PM Sarro (TU Delft - Electronic Components, Technology and Materials)
D Crawley (External organisation)
K Nikolic (External organisation)
M Forshaw (External organisation)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://resolver.tudelft.nl/uuid:2c925411-89c9-434b-ae18-053d7501f193
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Publication Year
2003
Research Group
Electronic Components, Technology and Materials
Volume number
212/213
Pages (from-to)
411-416
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