New fabrication technology for wafer-through hole interconnects
Conference Paper
(2001)
Author(s)
VG Kiutchoukov (External organisation)
E Boellaard (TU Delft - Electronic Components, Technology and Materials)
J.R. Mollinger (TU Delft - Electronic Instrumentation)
Andre Bossche (TU Delft - Electronic Instrumentation)
Research Group
Electronic Components, Technology and Materials
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https://resolver.tudelft.nl/uuid:ada22a5f-9c55-485f-8d26-1b240b104213
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Publication Year
2001
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
813-817
ISBN (print)
90-73461-29-4
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