18 records found
1
Trough-wafer copper plugs formation for 3-Dimensional ICs
Patterning of polyimide and metal in deep trenches
Through-wafer copper electroplating for 3-D interconnects
Through-wafer copper plugs formation for 3-dimensional ICs
Forming rounded convex corner by using two-step anisotropic koh wet etching
Though-wafer copper electropating for 3-D interconnects
New fabrication technology for wafer-through hole interconnects
Novel wafer-through technique for interconnects
Coating of deep anisotropically etched grooves with polymide and photoresist
Electrochemical deposition of copper in thin layers on planar surface [Russische tekst]
Patterning of polyimide and metal in deep grooves
Etching behavior of KOH at the convex corner
New photoresist coating method for 3-D structured wafers
Novel method for spinning of photoresist on wafers with through-holes
Uniform photoresist coating of anisotropically etched cavities in silicon
Rounding of wafer - hole corners in -oriented silicon wafer by anisotropic etching
Possibilities for application of electrochemical deposition of Cu for hole and channel filling in Si substrates
