3D Integration Technology for Quantum Computer based on Diamond Spin Qubits
R. Ishihara (TU Delft - QID/Ishihara Lab, TU Delft - Electrical Engineering, Mathematics and Computer Science, TU Delft - QuTech Advanced Research Centre, Kavli institute of nanoscience Delft)
J. Hermias (TU Delft - QuTech Advanced Research Centre, TU Delft - Technology, Policy and Management, Kavli institute of nanoscience Delft, TU Delft - Technology, Policy and Management)
S. Yu (TU Delft - QuTech Advanced Research Centre, Kavli institute of nanoscience Delft, TU Delft - QID/Ishihara Lab)
K. Y. Yu (Kavli institute of nanoscience Delft, TU Delft - QuTech Advanced Research Centre, TU Delft - Electrical Engineering, Mathematics and Computer Science)
S. Nur (Kavli institute of nanoscience Delft, TU Delft - Electrical Engineering, Mathematics and Computer Science)
T. Iwai (TU Delft - Electrical Engineering, Mathematics and Computer Science)
T. Miyatake (Fujitsu Laboratories)
K. Kawaguchi (Fujitsu Laboratories)
Y. Doi (Fujitsu Laboratories)
S. Sato (Fujitsu Laboratories)
Y. LI (Student TU Delft)
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Abstract
Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This enables an increased connectivity and a negligible crosstalk and error-rate when the number of qubits increases on-chip. Here, 3D integration is the key enabling technology for a large-scale integration of the diamond spin qubits with photonic circuits and CMOS electronics for routing, control and readout of qubits. Several engineering challenges exist in order to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. We will review trends, address challenges and discuss future outlook of the integration technology for realization of a scalable quantum computer based on diamond spin qubits.