Moisture Effects on a System in Package Carrier

Conference paper (2009)

Authors

X. Ma Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
W.D. van Driel Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering , Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
O van der Sluis Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
GQ Zhang External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2009

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

Moisture induced failures in the plastic encapsulated packages are one of the most important failure mechanisms in microelectronics. These failures are driven by the mismatch between different material properties, such as CTA, CME (Coefficient of Moisture induced Expansion) and degradation of interface strength caused by moisture absorption of polymer materials. Therefore, it is critical to know how much moisture exists in packaging materials, the moisture distribution in the package and hygro-mechanical effects on the package. In this paper moisture diffusion, moisture distribution and hygro-mechanical effects are simulated at the following conditions: 85°C/85%RH, 60°C/60%RH and 85°C/dry, 60°C/dry using 2D SiP (System in Package) finite element model.