CMOS-Compatible PureGaB Ge-on-Si APD pixel arrays

Journal Article (2016)
Authors

Amir Sammak (TU Delft - Electronic Components, Technology and Materials)

Mahdi Aminian (École Polytechnique Fédérale de Lausanne)

LK Nanver (Aalborg University)

E. Charbon ((OLD)Applied Quantum Architectures)

Research Group
Electronic Components, Technology and Materials
Copyright
© 2016 A. Sammak, Mahdi Aminian, L.K. Nanver, E. Charbon-Iwasaki-Charbon
To reference this document use:
https://doi.org/10.1109/TED.2015.2457241
More Info
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Publication Year
2016
Language
English
Copyright
© 2016 A. Sammak, Mahdi Aminian, L.K. Nanver, E. Charbon-Iwasaki-Charbon
Research Group
Electronic Components, Technology and Materials
Issue number
1
Volume number
63
Pages (from-to)
92-99
DOI:
https://doi.org/10.1109/TED.2015.2457241
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Abstract

Pure gallium and pure boron (PureGaB) Ge-on-Si photodiodes were fabricated in a CMOS compatible process and operated in linear and avalanche mode. Three different pixel geometries with very different area-to-perimeter ratios were investigated in linear arrays of 300 pixels with each a size of 26 × 26 μm2. The processing of anode contacts at the anode perimeters leaving oxide covered PureGaB-only light-entrance windows, created perimeter defects that increased the vertical Ge volume but did not deteriorate the diode ideality. The dark current at 1 V reverse bias was below 35 μA/cm2 at room temperature and below the measurement limit of 2.5 × 10-2 μA/cm2 at 77 K. Spread in dark current levels and optical gain, that reached the range of 106 at 77 K, was lowest for the devices with largest perimeter. All device types were reliably operational in a wide temperature range from 77 K to room temperature. The spectral sensitivity of the detectors extended from visible to the telecom band with responsivities of 0.15 and 0.135 A/W at 850 and 940 nm, respectively.

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