Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint

Conference paper (2022)

Authors

Guoping Lv Guilin University of Electronic Technology
Haidong Yan Zhejiang University
Haidong Yan Guilin University of Electronic Technology
Daoguo Yang Guilin University of Electronic Technology
Xinke Wu Zhejiang University
Kuang Sheng Zhejiang University
Chaohui Liu National New Energy Vehicle Technology Innovation
Yakun Zhang National New Energy Vehicle Technology Innovation
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
Copyright: © 2022 Guoping Lv, Haidong Yan, Haidong Yan, Daoguo Yang, Xinke Wu, Kuang Sheng, Chaohui Liu, Yakun Zhang, Kouchi Zhang
DOI
help_outline
https://doi.org/10.1109/ICEPT56209.2022.9873375
Large-area bonding Copper foam-Ag composite film Preparation process
More Info
expand_more

Published Date

2022

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials

Abstract

As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging modules due to their high thermal resistance and high-temperature reliability. To solve the above deficiency, a copper foam-silver composite was proposed in this paper, which was prepared by mixing copper foam solid skeleton with micron silver paste. According to the results of thermogravimetric analysis (TGA) of silver paste, the preheating process was determined and sintered at 270°C and 10MPa. The influence of different preparation technology on the quality of sintered joint was investigated. The morphology characteristics and distribution of sintered silver in the copper foam were observed by scanning electron microscope (SEM). The results show that the sintered silver of group C samples can be uniformly filled into the solid skeleton of copper foam, and the densification degree is high, without cracks, delamination, and holes. The shear strength can reach 55MPa.