Bonding Process of Copper Foam-Silver Composite and Performance Characterization of the Joint
Guoping Lv (Guilin University of Electronic Technology)
Haidong Yan (Zhejiang University - Hangzhou)
Haidong Yan (Guilin University of Electronic Technology)
Daoguo Yang (Guilin University of Electronic Technology)
Xinke Wu (Zhejiang University - Hangzhou)
Kuang Sheng (Zhejiang University - Hangzhou)
Chaohui Liu (National New Energy Vehicle Technology Innovation)
Yakun Zhang (National New Energy Vehicle Technology Innovation)
Guoqi Zhang (TU Delft - Electronic Components, Technology and Materials)
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Abstract
As a key heat-dissipating and electrical interconnecting component in high-temperature power modules, die-attach and substrate-attach layers play an important role in effectively reducing the thermal resistance and improving the long-term reliability. Traditional substrate-attach materials limit the high-temperature applications of packaging modules due to their high thermal resistance and high-temperature reliability. To solve the above deficiency, a copper foam-silver composite was proposed in this paper, which was prepared by mixing copper foam solid skeleton with micron silver paste. According to the results of thermogravimetric analysis (TGA) of silver paste, the preheating process was determined and sintered at 270°C and 10MPa. The influence of different preparation technology on the quality of sintered joint was investigated. The morphology characteristics and distribution of sintered silver in the copper foam were observed by scanning electron microscope (SEM). The results show that the sintered silver of group C samples can be uniformly filled into the solid skeleton of copper foam, and the densification degree is high, without cracks, delamination, and holes. The shear strength can reach 55MPa.