Wafer-Level Packaging Technology for RF Applications Based on a Rigid Low-Loss Spacer Substrate
Doctoral Thesis
(2006)
Author(s)
A Polyakov (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
To reference this document use:
https://resolver.tudelft.nl/uuid:421a048d-83ce-4c31-b23e-468986e2090d
More Info
expand_more
expand_more
Publication Year
2006
Research Group
Old - EWI Ch. Integrated Sensing Devices
ISBN (print)
90-9021110-1
No files available
Metadata only record. There are no files for this record.