A Poliakov

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Conference paper (2)

2 records found

Mechanical reliability of silicon wafers with through-wafer vias for wafer-level packaging

Conference paper (2002) - A Poliakov , M Bartek , JN Burghartz

Mechanical reliability of micromachined silicon wafers with deep rectangular recesses and Via-Hole fences

Conference paper (2002) - A Poliakov , M Bartek , JN Burghartz