Mechanical reliability of micromachined silicon wafers with deep rectangular recesses and Via-Hole fences
Conference Paper
(2002)
Author(s)
A Poliakov (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
M Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
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https://resolver.tudelft.nl/uuid:f72555ca-437d-426b-a998-89f42dcf9437
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Publication Year
2002
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
466-469
Publisher
Czech Technical University in Prague
Event
Eurosensors XVI, Praha, Czech Republik; (2002-09-15 - 2002-09-18), Praha, Czech Republik
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