Mechanical reliability of silicon wafers with through-wafer vias for wafer-level packaging
Conference Paper
(2002)
Author(s)
A Poliakov (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
M Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
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Publication Year
2002
Research Group
Old - EWI Ch. Integrated Sensing Devices
Bibliographical Note
CD-ROM
Pages (from-to)
1-5
Publisher
Elsevier
ISBN (print)
0-08-044181-5
Event
ESREF 2002, Rimini, Italy (2002-10-07 - 2002-10-11), New York
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