System performance of a cryogenic test-bed for the time-division multiplexing readout for the NewAthena X-ray Integral Field Unit

Journal Article (2024)
Author(s)

D. Vaccaro (SRON–Netherlands Institute for Space Research)

Jan Van Der Kuur (SRON–Netherlands Institute for Space Research)

Paul van der Hulst (SRON–Netherlands Institute for Space Research)

Martin De Wit (SRON–Netherlands Institute for Space Research)

Kevin Ravensberg (SRON–Netherlands Institute for Space Research)

J. A. Chervenak (NASA Goddard Space Flight Center)

Joseph Adams (CRESST and University of Maryland, NASA Goddard Space Flight Center)

Jan-Willem A. den Herder (Universiteit van Amsterdam, SRON–Netherlands Institute for Space Research)

J.R. Gao (TU Delft - ImPhys/Adam group, SRON–Netherlands Institute for Space Research)

More authors (External organisation)

Research Group
ImPhys/Adam group
DOI related publication
https://doi.org/10.1117/1.JATIS.10.4.046002
More Info
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Publication Year
2024
Language
English
Research Group
ImPhys/Adam group
Issue number
4
Volume number
10
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Abstract

The X-ray Integral Field Unit (X-IFU) is an instrument of European Space Agency's future NewAthena space observatory, with the goal to provide high-energy resolution (<4 eV at X-ray energies up to 7 keV) and high-spatial resolution (9 in.) spectroscopic imaging over the X-ray energy range from 200 eV to 12 keV, by means of an array of ∼1500 transition-edge sensors (TESs) read out via superconducting quantum interference device time-division multiplexing (TDM). A TDM-based laboratory test bed has been assembled at Netherlands Institute for Space Research, hosting an array of 75×75 μm2 TESs that are read out via 2-column × 32-row TDM. A system component that is critical to high-performance operation is the wiring harness that connects the room-temperature electronics to the cryogenic readout componentry. We report here on our characterization of such a test bed, whose harness has a length close to what was envisioned for X-IFU, which allowed us to achieve a co-added energy resolution at a level of 2.7-eV full width half maximum at 6 keV via 32-row readout. In addition, we provide an outlook on the integration of TDM readout into the X-IFU focal plane assembly development model.

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