Comparison of via-fabrication techniques for through-wafer electrical interconnect applications
Conference Paper
(2004)
Author(s)
A Poliakov (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
T Grob (External organisation)
RA Hovenkamp (External organisation)
HJ Kettelarij (External organisation)
I Eidner (External organisation)
MA Samber (External organisation)
M Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
To reference this document use:
https://resolver.tudelft.nl/uuid:4501c992-72d8-4a6e-bc61-2986e990e2b1
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Publication Year
2004
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
1466-1470
ISBN (print)
0-7803-8365-6
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