Reliability study of underfilled flip chip in micro-electronic packaging
Conference Paper
(2003)
Author(s)
X Ma (External organisation)
D Yang (TU Delft - Dynamics of Micro and Nano Systems)
JJ Chen (External organisation)
Research Group
Dynamics of Micro and Nano Systems
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https://resolver.tudelft.nl/uuid:4bcbb218-73c1-4c8b-8fe2-eed4bc8ef24b
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Publication Year
2003
Research Group
Dynamics of Micro and Nano Systems
Pages (from-to)
241-245
ISBN (print)
0-7803-7054-6
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