Fabrication of through-substrate cavities for hybrid wafer-level packaging

Sosin, S; Tian, J.; Wang, L.; Bartek, M.

Fabrication of through-substrate cavities for hybrid wafer-level packaging

Conference paper (2006)

Authors

S Sosin Old - EWI Ch. Integrated Sensing Devices

J. Tian Old - EWI Ch. Integrated Sensing Devices

L. Wang Micro and Nano Engineering

M. Bartek Old - EWI Ch. Integrated Sensing Devices

Research Group

Old - EWI Ch. Integrated Sensing Devices

Elektrotechniek

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Published Date

2006

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Research Group

Old - EWI Ch. Integrated Sensing Devices

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