Fabrication of through-substrate cavities for hybrid wafer-level packaging
Conference Paper
(2006)
Author(s)
S Sosin (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
J. Tian (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
L. Wang (TU Delft - Micro and Nano Engineering)
M Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
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https://resolver.tudelft.nl/uuid:4bd35e9a-9740-4136-8386-7dfebb7c1c67
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Publication Year
2006
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
544-547
ISBN (print)
90-73461-44-8
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