Plasma etching for failure analysis of integrated circuit packages
Conference Paper
(2011)
Author(s)
J Tang (TU Delft - Electronic Components, Technology and Materials)
JBJ Schelen (External organisation)
C.I.M. Beenakker (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1149/1.3567691
To reference this document use:
https://resolver.tudelft.nl/uuid:4c0cbb46-c547-46e6-aed6-6c8136c75b8f
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Publication Year
2011
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
913-918
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