Plasma etching for failure analysis of integrated circuit packages

Tang, J.; Schelen, JBJ; Beenakker, C. W J

Plasma etching for failure analysis of integrated circuit packages

Conference paper (2011)

Authors

J. Tang Electronic Components, Technology and Materials

JBJ Schelen External organisation

C. W J Beenakker Electronic Components, Technology and Materials

Research Group

Electronic Components, Technology and Materials

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Published Date

2011

Language

English

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Research Group

Electronic Components, Technology and Materials

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