Novel Method for Adhesion between PI-PDMS Using Butyl Rubber for Large Area Flexible Body Patches

Conference Paper (2017)
Author(s)

S. Joshi (Philips Research, TU Delft - Electronic Components, Technology and Materials)

R. Bagani (External organisation)

Lucas Beckers (Philips Research)

R. Dekker (Philips Research, TU Delft - Electronic Components, Technology and Materials)

Research Group
Electronic Components, Technology and Materials
Copyright
© 2017 S. Joshi, R. Bagani, Lucas Beckers, R. Dekker
DOI related publication
https://doi.org/10.3390/proceedings1040307
More Info
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Publication Year
2017
Language
English
Copyright
© 2017 S. Joshi, R. Bagani, Lucas Beckers, R. Dekker
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1-5
Reuse Rights

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Abstract

This paper reports the use of rubber—Polybutadiene as an intermediate adhesive layer for improving the adhesion between polyimide (PI) and silicone polydimethylsiloxane (PDMS) which is required for a reliable fabrication of flexible/stretchable body patches for various applications. The adhesive bond initiated by the butyl rubber (BR), apart from being extremely strong, is also chemically resistant and mechanically stable as compared to the state of the art processes of improving adhesion between PI and Silicone.