Novel Method for Adhesion between PI-PDMS Using Butyl Rubber for Large Area Flexible Body Patches
Shivani Joshi (Philips Research, TU Delft - Electronic Components, Technology and Materials)
R. Bagani (External organisation)
Lucas Beckers (Philips Research)
Ronald Dekker (Philips Research, TU Delft - Electronic Components, Technology and Materials)
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Abstract
This paper reports the use of rubber—Polybutadiene as an intermediate adhesive layer for improving the adhesion between polyimide (PI) and silicone polydimethylsiloxane (PDMS) which is required for a reliable fabrication of flexible/stretchable body patches for various applications. The adhesive bond initiated by the butyl rubber (BR), apart from being extremely strong, is also chemically resistant and mechanically stable as compared to the state of the art processes of improving adhesion between PI and Silicone.
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