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Novel Method for Adhesion between PI-PDMS Using Butyl Rubber for Large Area Flexible Body Patches

Conference Paper (2017)
Author(s)

Shivani Joshi (Philips Research, TU Delft - Electrical Engineering, Mathematics and Computer Science)

R. Bagani (External organisation)

Lucas Beckers (Philips Research)

Ronald Dekker (Philips Research, TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.3390/proceedings1040307 Final published version
More Info
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Publication Year
2017
Language
English
Research Group
Electronic Components, Technology and Materials
Article number
307
Pages (from-to)
1-5
Event
Eurosensors 2017 (2017-09-03 - 2017-09-06), Paris, France
Downloads counter
259
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Abstract

This paper reports the use of rubber—Polybutadiene as an intermediate adhesive layer for improving the adhesion between polyimide (PI) and silicone polydimethylsiloxane (PDMS) which is required for a reliable fabrication of flexible/stretchable body patches for various applications. The adhesive bond initiated by the butyl rubber (BR), apart from being extremely strong, is also chemically resistant and mechanically stable as compared to the state of the art processes of improving adhesion between PI and Silicone.