Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties

Yang, DG; Zhang, G.Q.; Ernst, L.J.; ... [et Al], ?

Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties

Conference paper (2001)

Authors

DG Yang External organisation

G.Q. Zhang External organisation

L.J. Ernst Dynamics of Micro and Nano Systems

? ... [et Al] External organisation

Research Group

Dynamics of Micro and Nano Systems

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Published Date

2001

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Research Group

Dynamics of Micro and Nano Systems

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