Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties

Conference paper (2001)

Authors

DG Yang External organisation
G.Q. Zhang External organisation
L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
et. al. External organisation
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2001

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems