Combined experimental and numerical investigation on flip chip solder fatigue with cure-dependent underfill properties
Conference Paper
(2001)
Author(s)
DG Yang (External organisation)
G.Q. Zhang (External organisation)
L.J. Ernst (TU Delft - Dynamics of Micro and Nano Systems)
et. et al. (External organisation)
Research Group
Dynamics of Micro and Nano Systems
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https://resolver.tudelft.nl/uuid:5a9525a0-5b84-4ae8-91f6-ed9be6a2e084
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Publication Year
2001
Research Group
Dynamics of Micro and Nano Systems
Pages (from-to)
919-924
ISBN (print)
0-7803-7038-4
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