Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering
Journal Article
(2014)
Author(s)
Y Liu (External organisation)
J Zhao (External organisation)
CCA Yuan (External organisation)
GQ Zhang (TU Delft - Electronic Components, Technology and Materials)
F Sun (External organisation)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/TCPMT.2014.2358266
To reference this document use:
https://resolver.tudelft.nl/uuid:5cc6470b-fb7e-4a3b-bc70-182b340e8ed7
More Info
expand_more
expand_more
Publication Year
2014
Language
English
Research Group
Electronic Components, Technology and Materials
Issue number
11
Volume number
4
Pages (from-to)
1754-1759
No files available
Metadata only record. There are no files for this record.