Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering

Journal article (2014)

Authors

Y Liu External organisation
J Zhao External organisation
CCA Yuan External organisation
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
F Sun External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2014

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials