Copper-based composite sintering materials and reliability analysis for power electronics packaging
Xinyue Wang (Fudan University)
Zhoudong Yang (Fudan University)
Letao Bian (Fudan University)
Wenting Liu (Fudan University)
Guoqi Zhang (TU Delft - Electronic Components, Technology and Materials)
Jing Zhang (Heraeus Materials Technology Shanghai Ltd.)
Chuantong Chen (Osaka University)
Pan Liu (Research Institute of Fudan University, Ningbo, Fudan University)
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Abstract
While silver-based sintered materials are limited by cost and electromigration, and copper faces challenges with oxidation at high temperatures, Cu-based composite sintering materials offer promising alternative solutions. This review examines recent advances in Cu-based composite sintered materials for die-attach in power electronics packaging, focusing on their mechanical, thermal, electrical properties, and reliability. This review systematically categorizes such compounding strategies, including direct mixing, core-shell structures, and alloying, analyzing the impact on composite properties. Furthermore, the reliability of Cu-based composite sintered joints is evaluated, addressing high-temperature storage, thermal cycling, corrosion, and electrochemical migration. Challenges such as oxidation resistance, process optimization, and cost-effectiveness are discussed, together with future research directions. This work aims to support researchers in advancing Cu-based composite sintering materials research and development, broadening material options for high-temperature power electronics packaging applications.
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