Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation

Book chapter (2012)

Authors

S.W. Koh Electronic Components, Technology and Materials - EEMCS
A Saxena External organisation
W.D. van Driel Electronic Components, Technology and Materials - EEMCS
GQ Zhang External organisation
R Tummala External organisation
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2012

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials