Semi empirical low cycle fatigue crack growth analysis of nanostructure chip-to-package copper interconnect using molecular simulation
Book Chapter
(2012)
Author(s)
Sau Koh (TU Delft - Electronic Components, Technology and Materials)
A Saxena (External organisation)
Willem D. van Driel (TU Delft - Electronic Components, Technology and Materials)
GQ Zhang (External organisation)
R Tummala (External organisation)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1007/978-1-4614-1728-6_5
To reference this document use:
https://resolver.tudelft.nl/uuid:6a09cb11-a292-4edd-b7f3-e1ab61ab8433
More Info
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Publication Year
2012
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
77-90
ISBN (print)
978-1-4614-1727-9
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