Role of the Copper Microstructure on Ethylene Stability during CO2 Electrolysis

Journal Article (2026)
Author(s)

Jesse Kok (TU Delft - ChemE/Materials for Energy Conversion and Storage)

Nikita Kolobov (TU Delft - ChemE/Materials for Energy Conversion and Storage)

Mohammed Sharah (Student TU Delft)

Amirhossein Foroozan (McMaster University)

Shayan Angizi (McMaster University)

Konstantinos Dimitriou (Student TU Delft)

Drew Higgins (McMaster University)

Thomas Burdyny (TU Delft - ChemE/Materials for Energy Conversion and Storage)

DOI related publication
https://doi.org/10.1021/acsenergylett.6c00513 Final published version
More Info
expand_more
Publication Year
2026
Language
English
Journal title
ACS Energy Letters
Issue number
4
Volume number
11
Pages (from-to)
3633-3641
Downloads counter
14
Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Abstract

Catalyst lifetime is a primary technical bottleneck obstructing Cu-based CO2 reduction (CO2R), with restructuring via dissolution-redeposition being a commonly reported reason for selectivity loss. Here we examine how atomistic restructuring manifests at the microlevel of gas diffusion electrode (GDE)-based systems, ultimately compromising long-term CO2R performance. Using a flow-cell CO2R electrolyzer configuration and a copper-coated PTFE GDE, we first show how voltage gradients result in directional in-plane copper migration and porosity changes, causing a decrease in CO and ethylene production due to blocked catalyst pores. By the incorporation of different ionomer and inert carbon overlayers onto copper, we then demonstrate how in-plane degradation is mitigated by modulating the local pH and voltage homogeneity of the electrode, extending ethylene lifetimes by 10-fold. Ultimately, through-plane compaction of copper then becomes the limiting degradation pathway. Combined, these results provide rationale for the paradox of why copper degradation in membrane-electrode assemblies illustrates 100-fold greater stabilities than H-cell and flow-cell architecture.