High aspect ratio copper electroplating process for compact coplanar transmission line implementation
Conference Paper
(2005)
Author(s)
H Sagkol (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
B. Rejaei Salmassi (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
To reference this document use:
https://resolver.tudelft.nl/uuid:7f49c131-7897-45d8-bb25-6facc50534f9
More Info
expand_more
expand_more
Publication Year
2005
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
43-46
ISBN (print)
90-73461-50-2
No files available
Metadata only record. There are no files for this record.