BR
B. Rajaei Salmasi
Authored
20 records found
An optimized Saddle-add-on metallization process is used on surface passivated high resistivity silicon substrate to implement very high quality (Q) factor inductors. Test inductors with 5 and 10 nH inductance values are realized and measured to have maximum Q values of 37 at 1.5
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A granular NiFe thin film with large in-plane magnetic anisotropy and high ferromagnetic-resonance frequency developed for radio-frequency integrated circuit (IC) applications is presented. During the deposition, three-dimensional (3D) growth occurs, yielding NiFe grains (~1.0 µm
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A cost-effective add-on process module for reducing ohmic losses of radio-frequency (RF) inductors and interconnects in RF/BiCMOS and RF/CMOS technologies built on CMOS logic processes is proposed. The module is based on the local thickening of the top metal layer of the thin CMO
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