Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition

Conference paper (2009)

Authors

L. Mele Electronic Components, Technology and Materials -

B. Morana Electronic Components, Technology and Materials -

C.R. de Boer Electronic Components, Technology and Materials -

J.F. Creemer Electronic Components, Technology and Materials -

Pasqualina M Sarro Electronic Components, Technology and Materials -

Research Group

Electronic Components, Technology and Materials () (TU Delft)

More Info

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http://resolver.tudelft.nl/uuid:840474bc-b95e-41d0-96cf-471ad8a421a6

Published Date

2009

Language

Undefined/Unknown

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials