Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition
Conference Paper
(2009)
Author(s)
L Mele (TU Delft - Electrical Engineering, Mathematics and Computer Science)
B Morana (TU Delft - Electrical Engineering, Mathematics and Computer Science)
CR de Boer (TU Delft - Electrical Engineering, Mathematics and Computer Science)
JF Creemer (TU Delft - Electrical Engineering, Mathematics and Computer Science)
PM Sarro (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Research Group
Electronic Components, Technology and Materials
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https://resolver.tudelft.nl/uuid:840474bc-b95e-41d0-96cf-471ad8a421a6
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Publication Year
2009
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1531-1534
Publisher
Elsevier
Event
Eurosensors XXIII (2009-09-06 - 2009-09-09), Lausanne, Switzerland
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