Combining UV-and Electron beam lithography for superconducting bandpass filters in mm/sub-mm astronomy

Conference paper (2020)

Authors

David Thoen Tera-Hertz Sensing - EEMCS
V. Murugesan Mechanical Engineering
K. Karatsu Tera-Hertz Sensing - EEMCS
A. Pascual Laguna Electrical Engineering, Mathematics and Computer Science
A. Endo Tera-Hertz Sensing - EEMCS
J.J.A. Baselmans Tera-Hertz Sensing - EEMCS
Research Group
Tera-Hertz Sensing (EEMCS) (TU Delft)
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Published Date

2020

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Tera-Hertz Sensing

Abstract

Microfabrication of on-chip filterbanks, such as DESHIMA 2.0, would greatly benefit from reliable fabrication with sub-micrometer resolution. This enables smaller devices and reduces scatter in parameters such as filter bandwidth and resonant frequency. Here we present “mix-and-match” processing by combining optical and electron-beam exposures of a single layer of negative ma-N1405 resist from Micro-Resist-Technology GmbH. This allows for minimal features down to 300 nm where needed and large structure exposure with UV, limiting e-beam writing time. Relative alignment is possible to less than 500 nm on a regular basis.