Thermally enhanced SMT power components

Abstract

The paper introduces new x-dimension (x-dim) components that allow for high components packaging density and automated manufacturing of power converters. The x-dim components are double sided SMT passives, having uniform height (x) and enhanced thermal properties. With stacked converter construction and the x-dim components soldered to two sides, the heat removal from the systems can be significantly improved. This publication presents various methods to manufacture thermally enhanced x-dim components. The thermal behaviour of x-dim components is improved by integrating heat extractors, removing packaging materials and filling the air gaps by potting compounds. In the stacked construction, thermal enhancement of one component improves heat removal from other components, placed in adjacent stack layers. Thermal performance of x-dim components in both standard and stacked converter constructions is evaluated by FEM and analytical simulations. New x-dim components employed in stacked construction play a key role in overcoming current power density limits.