IJ
I. Josifovic
Authored
20 records found
This paper investigates the switching behaviour of normally-off SiC JFETs in an inverter for a motor drive. The parasitic ringing caused by different parasitic effects is analysed. Two different methods, the use of an RC snubber and the use of a ferrite bead, are proposed for dam
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This paper proposes a comprehensive EMI common-mode (CM) filter design procedure to suppress conducted EMI in silicon carbide (SiC) JFETs based inverter-fed motor drive systems. The first part of this paper is focusing on analyzing the EMC issue arisen from the newly generated po
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This paper presents a novel power electronics construction technology for surface mount technology (SMT) automated manufacturing of power converters- Power Sandwich. The Power Sandwich manufacturing method employs new x-dimension components, having the same height (x) and double
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This paper introduces a new concept for surface mount technology (SMT) automated manufacturing of power converters - PCB power sandwich. The power sandwich manufacturing method employs new x-dimension (x-dim) components, having the same height (x) and double sided SMT electrical
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The paper presents the design and construction of new SMT power inductors that allow for high components packaging density and automated manufacturing of power converters. The inductors are double sided SMDs with a uniform profile (14mm), reduced packaging (i.e. no coil former) a
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Abstract
Current passive components construction technologies and power converters manufacturing methods are the main barriers limiting the power density improvement. In this paper a new PCB system integration concept for power converters construction - power sandwich, that allow
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This paper presents thermal management considerations for a multilayer stacked converter construction technology Power Sandwich. The multilayer converters are built using novel x-dim components that have uniform height and double-sided SMT terminals. The SMT terminals of the comp
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The paper introduces new x-dimension (x-dim) components that allow for high components packaging density and automated manufacturing of power converters. The x-dim components are double sided SMT passives, having uniform height (x) and enhanced thermal properties. With stacked co
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This work presents an implementation of a compact and highly efficient 2.2kW industrial drive using the Power Sandwich layered construction, x-dimension (x-dim) passive components and wide-band gap SiC semiconductors (JFETs and diodes). X-dim SMT components that have uniform heig
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Presents a collection of slides covering the following topics: commercial power electronics; power sandwich concept for manufacturability; inductors; capacitors; SMT automated manufacturing; pick and place; soldering; multilayer thermal management concept; temperature distributio
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