Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives
Conference Paper
(2004)
Author(s)
M. Bartek (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
SM Sinaga (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
P Mendes (TU Delft - Electronic Components, Technology and Materials)
JH Correia (External organisation)
JN Burghartz (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
To reference this document use:
https://resolver.tudelft.nl/uuid:889b9474-ad6a-4ed9-884e-d5bae2ad6358
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Publication Year
2004
Research Group
Old - EWI Ch. Integrated Sensing Devices
Pages (from-to)
227-230
ISBN (print)
0-7803-8535-7
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