LCT integration optimization on a printed circuit board technology platform

Abstract

Prominent integration efforts, implementing various technologies and focussing on electromagnetic integration in the first place, have already been attempted in the past, with promising results. From a manufacturing point of view combining different technologies is a costly and complex process which also decreases the system reliability. The use of a single technology for integration therefore holds obvious advantages. An approach to realise an integrated resonant circuit completely in PCB technology is investigated. It is shown that electromagnetic and technology platform integration does not always go together. In this case, for the sake of low cost and manufacturability, technology integration goes first.