Direct wafer bonding of processed LPCVD silicon nitride films

Conference Paper (2006)

Author(s)

CL Hsu (External organisation)

J.F. Creemer (TU Delft - Old - EWI Sect. ECTM)

G Pandraud (TU Delft - QN/High Resolution Electron Microscopy)

J.C. Wolff (TU Delft - Old - EWI Ch. Integrated Sensing Devices)

B.J. Thijsse (TU Delft - OLD Virtual Materials and Mechanics)

PM Sarro (TU Delft - Electronic Components, Technology and Materials)

P. J. French (TU Delft - Electronic Instrumentation)

Research Group

Old - EWI Sect. ECTM

Elektrotechniek Techniek Conf.proc. > 3 pag Conference contrib. refereed

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Publication Year

2006

Research Group

Old - EWI Sect. ECTM

Pages (from-to)

89-92

ISBN (print)

085432-648-3

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