Direct wafer bonding of processed LPCVD silicon nitride films

Hsu, CL; Creemer, J.F.; Pandraud, G.; Wolff, J.C.; Thijsse, B.J.; Sarro, Pasqualina M; French, P.J.

Direct wafer bonding of processed LPCVD silicon nitride films

Conference paper (2006)

Authors

CL Hsu External organisation

J.F. Creemer Old - EWI Sect. ECTM

G. Pandraud QN/High Resolution Electron Microscopy

J.C. Wolff Old - EWI Ch. Integrated Sensing Devices

B.J. Thijsse OLD Virtual Materials and Mechanics

Pasqualina M Sarro Electronic Components, Technology and Materials -

P.J. French Electronic Instrumentation -

Research Group

Old - EWI Sect. ECTM

Elektrotechniek Techniek

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Published Date

2006

Language

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Research Group

Old - EWI Sect. ECTM