Implementation of General Coupling Model of Electromigration in ANSYS

Conference Paper (2020)
Author(s)

Zhen Cui (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Xuejun Fan (Lamar University)

Guoqi Zhang (TU Delft - Electrical Engineering, Mathematics and Computer Science)

Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/ECTC32862.2020.00256 Final published version
More Info
expand_more
Publication Year
2020
Language
English
Research Group
Electronic Components, Technology and Materials
Article number
9159445
Pages (from-to)
1632-1637
ISBN (print)
978-1-7281-6181-5
ISBN (electronic)
978-1-7281-6180-8
Event
70th IEEE Electronic Components and Technology Conference, ECTC 2020 (2020-06-03 - 2020-06-30), Orlando, United States
Downloads counter
314
Collections
Institutional Repository
Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Abstract

In this paper, a recently developed theory - general coupling model of electromigration, is implemented in ANSYS. We first identify several errors provided in ANSYS manual for electromigration modeling. Then the general coupling model is implemented in ANSYS and the detailed description is presented. Finally, a 1-D confined metal line with a perfectly blocking condition is presented as a benchmark problem, in which the finite element solutions are in excellent agreement with the analytical solutions.

Files

License info not available