Implementation of General Coupling Model of Electromigration in ANSYS

Conference Paper (2020)
Author(s)

Zhen Cui (TU Delft - Electronic Components, Technology and Materials)

X.J. Fan (Lamar University)

Guo Qi Zhang (TU Delft - Electronic Components, Technology and Materials)

Research Group
Electronic Components, Technology and Materials
Copyright
© 2020 Z. Cui, Xuejun Fan, Kouchi Zhang
DOI related publication
https://doi.org/10.1109/ECTC32862.2020.00256
More Info
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Publication Year
2020
Language
English
Copyright
© 2020 Z. Cui, Xuejun Fan, Kouchi Zhang
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1632-1637
ISBN (print)
978-1-7281-6181-5
ISBN (electronic)
978-1-7281-6180-8
Reuse Rights

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Abstract

In this paper, a recently developed theory - general coupling model of electromigration, is implemented in ANSYS. We first identify several errors provided in ANSYS manual for electromigration modeling. Then the general coupling model is implemented in ANSYS and the detailed description is presented. Finally, a 1-D confined metal line with a perfectly blocking condition is presented as a benchmark problem, in which the finite element solutions are in excellent agreement with the analytical solutions.

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