3D Integration for Modular Quantum Computer based on Diamond Spin Qubits

Conference paper (2023)

Authors

R. Ishihara Quantum Circuit Architectures and Technology - EEMCS , QuTech Advanced Research Centre, QID/Ishihara Lab - QuTech Advanced Research Centre
Jeffrel Hermias Student
S. Neji Student
K.Y. Yu QID/Ishihara Lab - QuTech Advanced Research Centre , QuTech Advanced Research Centre
M.C. van der Maas QuTech Advanced Research Centre, QID/Ishihara Lab - QuTech Advanced Research Centre
S. Nur QID/Ishihara Lab - QuTech Advanced Research Centre , QuTech Advanced Research Centre
T. Iwai Fujitsu Limited
T. Miyatake Fujitsu Limited
S. Miyahara Fujitsu Limited
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Affiliation
QuTech Advanced Research Centre
Copyright: © 2023 R. Ishihara, J. Hermias, S. Neji, K.Y. Yu, M.C. van der Maas, S. Nur, T. Iwai, T. Miyatake, S. Miyahara, More Authors
DOI
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https://doi.org/10.1109/IITC/MAM57687.2023.10154649
3D integration Quantum computer Flip-chip bonding Photonic circuits
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Published Date

2023

Language

English

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Affiliation

QuTech Advanced Research Centre

Abstract

Quantum computer chip based on spin qubits in diamond uses modules that are entangled with on-chip optical links. This enables an increased connectivity and a negligible crosstalk and error-rate when the number of qubits increases onchip. Here, 3D integration is the key enabling technology for a large-scale integration of the diamond spin qubits with photonic and electronic circuits for routing, control and readout of qubits. There are several engineering challenges to integrate the large number of spins in diamond with the on-chip circuits operating at a cryogenic temperature. In this paper we will address challenges, present recent results and discuss future outlook of the integration technology for realization of a scalable quantum computer based on diamond spin qubits.