The effect of bond-line thickness on fatigue crack growth rate in adhesively bonded joints
John- Alan Pascoe (TU Delft - Structural Integrity & Composites)
N. Zavatta (TU Delft - Structural Integrity & Composites, University of Bologna)
Enrico Troiani (University of Bologna)
R.C. Alderiesten (TU Delft - Structural Integrity & Composites)
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Abstract
The effect of adhesive thickness on fatigue crack growth in an epoxy film adhesive (FM94) was investigated, using a combination of experiments and numerical modelling. For the range of thicknesses investigated an increased thickness led to an increased crack growth rate. It was found that the energy required per unit of crack growth did not depend on the adhesive thickness. In contrast, the energy available for crack growth does depend on the adhesive thickness. The numerical analysis confirms that the energy required per unit crack growth is not sensitive to the adhesive thickness, but that the plastic energy dissipation increases with the thickness. The experimental results imply that this increase of plasticity has an anti-shielding effect, as the crack growth rate is increased.