Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation
Conference Paper
(2015)
Authors
J Tang (External organisation)
MR Curiel (External organisation)
SL Furcone (External organisation)
EGJ Reinders (External organisation)
CTA Revenberg (External organisation)
Kees Beenakker (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Faculty
Electrical Engineering, Mathematics and Computer Science
To reference this document use:
https://doi.org/10.1109/ECTC.2015.7159691
TU Delft Repository resolver:
https://resolver.tudelft.nl/9cd9e03c-33ca-437a-ab37-3a2873ed7422
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Publication Year
2015
Language
English
Faculty
Electrical Engineering, Mathematics and Computer Science
Pages (from-to)
845-852
ISBN (print)
978-147998609-5
DOI:
https://doi.org/10.1109/ECTC.2015.7159691
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