Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation
Conference Paper
(2015)
Author(s)
J. Tang (External organisation)
MR Curiel (External organisation)
SL Furcone (External organisation)
EGJ Reinders (External organisation)
CTA Revenberg (External organisation)
C.I.M. Beenakker (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Faculty
Electrical Engineering, Mathematics and Computer Science
DOI related publication
https://doi.org/10.1109/ECTC.2015.7159691
To reference this document use:
https://resolver.tudelft.nl/uuid:9cd9e03c-33ca-437a-ab37-3a2873ed7422
More Info
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Publication Year
2015
Language
English
Faculty
Electrical Engineering, Mathematics and Computer Science
Pages (from-to)
845-852
ISBN (print)
978-147998609-5
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