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EGJ Reinders
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3 records found
Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma
Conference paper -
J. Tang
,
EGJ Reinders
,
CTA Revenberg
,
JBJ Schelen
,
C.I.M. Beenakker
Failure analysis of complex 3D stacked-die IC packages using Microwave Induced Plasma afterglow decapsulation
Conference paper -
J Tang
,
MR Curiel
,
SL Furcone
,
EGJ Reinders
,
CTA Revenberg
,
C.I.M. Beenakker
Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages
Conference paper -
J. Tang
,
CH Chen
,
SK Liang
,
EGJ Reinders
,
CTA Revenberg
,
JBJ Schelen
,
C.I.M. Beenakker