Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages
Conference Paper
(2013)
Authors
J Tang (TU Delft - Electronic Components, Technology and Materials)
CH Chen (External organisation)
SK Liang (External organisation)
EGJ Reinders (External organisation)
CTA Revenberg (External organisation)
JBJ Schelen (External organisation)
Kees Beenakker (TU Delft - Electrical Engineering, Mathematics and Computer Science)
Research Group
Electronic Components, Technology and Materials
To reference this document use:
https://doi.org/10.1109/ECTC.2013.6575806
TU Delft Repository resolver:
https://resolver.tudelft.nl/23c0a5c8-819d-498a-be17-ead4cee63a46
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Publication Year
2013
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
1717-1723
ISBN (print)
978-1-4799-0233-0
DOI:
https://doi.org/10.1109/ECTC.2013.6575806
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