Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

Tang, J.; Chen, CH; Liang, SK; Reinders, EGJ; Revenberg, CTA; Schelen, JBJ; Beenakker, C.I.M.

Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages

Conference paper (2013)

Authors

J. Tang Electronic Components, Technology and Materials -

CH Chen External organisation

SK Liang External organisation

EGJ Reinders External organisation

CTA Revenberg External organisation

JBJ Schelen External organisation

C.I.M. Beenakker Electrical Engineering, Mathematics and Computer Science

Research Group

Electronic Components, Technology and Materials () (TU Delft)

To reference this document use:

http://resolver.tudelft.nl/uuid:23c0a5c8-819d-498a-be17-ead4cee63a46

More Info

expand_more

Published Date

2013

Language

English

Reuse Rights

Other than for strictly personal use, it is not permitted to download, forward or distribute the text or part of it, without the consent of the author(s) and/or copyright holder(s), unless the work is under an open content license such as Creative Commons.

Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials