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SK Liang
Academic Work (1)
Conference paper (1)
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Microwave induced plasma decapsulation of stressed and delaminated high pin-count copper wire bonded IC packages
Conference paper (2013) -
J. Tang (author)
,
CH Chen (author)
,
SK Liang (author)
,
EGJ Reinders (author)
,
CTA Revenberg (author)
,
JBJ Schelen (author)
,
C.I.M. Beenakker (author)
