Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma

Conference paper (2012)

Authors

J. Tang Electronic Components, Technology and Materials - EEMCS
EGJ Reinders External organisation
CTA Revenberg External organisation
JBJ Schelen External organisation
C.I.M. Beenakker Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2012

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials