Decapsulation of high pin count IC packages with palladium coated copper wire bonds using an atmospheric pressure plasma
Conference Paper
(2012)
Author(s)
J. Tang (TU Delft - Electronic Components, Technology and Materials)
EGJ Reinders (External organisation)
CTA Revenberg (External organisation)
JBJ Schelen (External organisation)
C.I.M. Beenakker (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/EPTC.2012.6507071
To reference this document use:
https://resolver.tudelft.nl/uuid:08d7c4f2-5ba6-4dac-9785-21dd58e71d0d
More Info
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Publication Year
2012
Language
English
Research Group
Electronic Components, Technology and Materials
Pages (from-to)
165-169
ISBN (print)
978¿1¿4673¿4551¿4
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