Thermal simulation of flexible LED package enhanced with copper pillars
Journal Article
(2015)
Author(s)
Y. Liu (TU Delft - Electronic Components, Technology and Materials)
SYY Leung (External organisation)
K.Y. Wong (TU Delft - Electronic Components, Technology and Materials)
CA Yuan (External organisation)
Guo-Qi Zhang (TU Delft - Electronic Components, Technology and Materials)
Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1088/1674-4926/36/6/064011
To reference this document use:
https://resolver.tudelft.nl/uuid:a0e36f80-df9f-4008-88fe-eb5e891e7388
More Info
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Publication Year
2015
Language
English
Research Group
Electronic Components, Technology and Materials
Issue number
6
Volume number
36
Pages (from-to)
064011-1-064011-4
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