Thermal simulation of flexible LED package enhanced with copper pillars

Journal article (2015)

Authors

Y. Liu Electronic Components, Technology and Materials - EEMCS
SYY Leung External organisation
K.Y. Wong Electronic Components, Technology and Materials - EEMCS
CA Yuan External organisation
Kouchi Zhang Electronic Components, Technology and Materials - EEMCS
Research Group
Electronic Components, Technology and Materials (EEMCS) (TU Delft)
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Published Date

2015

Language

English

Reuse Rights

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Faculty

Electrical Engineering, Mathematics and Computer Science

Department

Microelectronics

Research Group

Electronic Components, Technology and Materials