SiC MOSFET Threshold-Voltage Instability under High Temperature Aging

Conference Paper (2018)
Author(s)

Yang Liu (Chongqing University)

Xianping Chen (Guilin University of Electronic Technology, Chongqing University)

ZhaoHui Zhao (Beijing COMPO Advanced Technology Co.)

ZhiGang Li (Beijing COMPO Advanced Technology Co.)

CaiTao Lu (Beijing COMPO Advanced Technology Co.)

JingGuo Zhang (GRIPM Advanced Materials Co., Beijing)

Huaiyu Ye (Chongqing University)

Sau Wee Koh (Huawei Technologies Company Ltd.)

LiGen Wang (General Research Institute for Nonferrous Metals)

Guoqi Zhang (TU Delft - Electronic Components, Technology and Materials)

Research Group
Electronic Components, Technology and Materials
DOI related publication
https://doi.org/10.1109/ICEPT.2018.8480781
More Info
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Publication Year
2018
Language
English
Research Group
Electronic Components, Technology and Materials
Article number
8480781
Pages (from-to)
347-350
ISBN (electronic)
978-1-5386-6386-8
Event
ICEPT 2018 (2018-08-08 - 2018-08-11), Shanghai, China
Downloads counter
196

Abstract

A systematic study of discrete SiC MOSFETs' reliability under High Temperature stress has been carried out. High Temperature stress is performed in this work to characterize the threshold voltage instability. To investigate the degradation mechanism of devices, simulation according to the structure of MOSFET cell has been performed. The result shows that the threshold voltages change trends of both MOSFETs are the same, including drop-down period at very early time due to a decrease of doping concentration at channel region and gradual raise-up period at in the rest of time resulting from decline of interface charge.

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