Substrate crosstalk suppression using wafer-level packaging: metalized through-substrate trench approach
Doctoral Thesis
(2010)
Author(s)
SM Sinaga (TU Delft - Old - EWI Ch. Integrated Sensing Devices)
Research Group
Old - EWI Ch. Integrated Sensing Devices
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https://resolver.tudelft.nl/uuid:a4503d97-cf48-4522-8298-0d366081b44e
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Publication Year
2010
Language
English
Research Group
Old - EWI Ch. Integrated Sensing Devices
ISBN (print)
978-90-8570-600-7
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