Moisture Diffusion Model Verification of Packaging Materials

Conference paper (2008)

Authors

X. Ma Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
K.M.B. Jansen Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
L.J. Ernst Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
W.D. van Driel Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering , Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
O van der Sluis Computational Design and Mechanics - Mechanical, Maritime and Materials Engineering
GQ Zhang External organisation
C Regard External organisation
C Gautier External organisation
H Frémont External organisation
Research Group
Computational Design and Mechanics (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2008

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Computational Design and Mechanics

Abstract

The use of the non-hermetic material for electronic packaging does raise a potential concern, i.e. moisture induced interfacial delamination and pop corning during reflow. Therefore, it is very important we can correctly model the moisture absorption property. In this study, moisture absorption and desorption properties of three kinds of package materials were investigated. Moisture absorption equilibrium weight gain and diffusion coefficient at different temperature and different humidity are characterized. Moisture absorption processes are simulated using a 3D model at conditions according to the moisture sensitivity test levels. Finally moisture absorption is verified by our research carrier.