A high-order 2D-plate macro-element model for the analysis of bonded joints

Journal Article (2026)
Author(s)

Marcello Calì (Institut Clément Ader, TU Delft - Group Teixeira De Freitas)

Sébastien Schwartz (Institut Clément Ader)

Frédéric Lachaud (Institut Clément Ader)

Sofia Teixeira De Freitas (Universidade de Lisbon, TU Delft - Group Teixeira De Freitas)

Éric Paroissien (Institut Clément Ader)

Research Group
Group Teixeira De Freitas
DOI related publication
https://doi.org/10.1016/j.ijsolstr.2025.113787
More Info
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Publication Year
2026
Language
English
Research Group
Group Teixeira De Freitas
Bibliographical Note
Green Open Access added to TU Delft Institutional Repository as part of the Taverne amendment. More information about this copyright law amendment can be found at https://www.openaccess.nl. Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.@en
Volume number
327
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Abstract

Adhesive bonding has emerged as an attractive solution for the joining of lightweight structures, yet accurate stress analysis remains computationally demanding when relying on Finite Elements (FE). This paper introduces a novel plate Macro-Element (ME) formulation that extends previous beam-type approaches to enable three-dimensional stress analysis of bonded joints. High-order polynomial expansions are employed to describe the displacement field of the adherends, while the adhesive is modeled as an elastic foundation. Governing equations are derived using a variational principle and integrated within a standard FE framework. Through the derivation of a special stiffness matrix, a ME can simulate an entire overlap with just one element. The proposed methodology is validated against FE results for a single-lap bonded joint with a thin adhesive layer. The influence of different higher-order displacement assumptions and constitutive models is investigated. The results show that their inclusion in the formulation improves the solution accuracy.

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