Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

Journal article (2003)

Authors

WD van Driel External organisation
JHJ Janssen External organisation
GQ Zhang External organisation
L.J. Ernst Dynamics of Micro and Nano Systems - Mechanical, Maritime and Materials Engineering
DG Yang External organisation
Research Group
Dynamics of Micro and Nano Systems (Mechanical, Maritime and Materials Engineering) (TU Delft)
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Published Date

2003

Language

Undefined/Unknown

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Faculty

Mechanical, Maritime and Materials Engineering

Department

Precision and Microsystems Engineering

Research Group

Dynamics of Micro and Nano Systems