Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

van Driel, WD; Janssen, JHJ; Zhang, GQ; Ernst, L.J.; Yang, DG

Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

Journal article (2003)

Authors

WD van Driel External organisation

JHJ Janssen External organisation

GQ Zhang External organisation

L.J. Ernst Dynamics of Micro and Nano Systems

DG Yang External organisation

Research Group

Dynamics of Micro and Nano Systems

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Published Date

2003

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Research Group

Dynamics of Micro and Nano Systems

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