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Wv
WD van Driel
Academic Work (26)
Conference paper (20)
Journal article (6)
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26 records found
1
2
Establishment of the mesoscale parameters for epoxy-copper interfacial separation
Conference paper (2012) -
K.Y. Wong (author)
,
SYY Leung (author)
,
René H. Poelma (author)
,
K.M.B. Jansen (author)
,
CCA Yuan (author)
,
WD van Driel (author)
,
Kouchi Zhang (author)
Advanced structural similarity rules for the BGA package family
Conference paper (2005) -
WD van Driel (author)
,
A. Mavinkurve (author)
,
MAJ van Gils (author)
,
GQ Zhang (author)
,
DG Yang (author)
,
L.J. Ernst (author)
Mechanism-based delamination prediction during reflow with moisture preconditioning
Conference paper (2004) -
X Fan (author)
,
GQ Zhang (author)
,
WD van Driel (author)
,
L.J. Ernst (author)
Virtual qualification of moisture induced failures of advanced packages
Conference paper (2004) -
MAJ van Gils (author)
,
WD van Driel (author)
,
GQ Zhang (author)
,
HJL Bressers (author)
,
RBR van Silfhout (author)
,
XJ Fan (author)
,
JHJ Jansen (author)
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods
Journal article (2004) -
WD van Driel (author)
,
C Liu (author)
,
GQ Zhang (author)
,
JHJ Janssen (author)
,
RBR van Silfhout (author)
,
MAJ van Gils (author)
,
L.J. Ernst (author)
On wire failures in micro-electronic packages
Conference paper (2004) -
WD van Driel (author)
,
JHJ Jansen (author)
,
RBR van Silfhout (author)
,
MAJ van Gils (author)
,
GQ Zhang (author)
,
L.J. Ernst (author)
Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques
Conference paper (2004) -
RBR van Silfhout (author)
,
WD van Driel (author)
,
Yaocheng Li (author)
,
MAJ van Gils (author)
,
JHJ Jansen (author)
,
GQ Zhang (author)
,
G Tao (author)
,
J Bisschop (author)
,
L.J. Ernst (author)
Virtual prototyping and qualification of Board Level Assembly
Conference paper (2004) -
WD van Driel (author)
,
GQ Zhang (author)
,
JWC de Vries (author)
,
M Jansen (author)
,
L.J. Ernst (author)
Prediction of thermo-mechanical integrity of wafer backend processes
Journal article (2004) -
V Gonda (author)
,
JMJ den Toonder (author)
,
J Beijer (author)
,
GQ Zhang (author)
,
WD van Driel (author)
,
ROJM Hoofman (author)
,
L.J. Ernst (author)
From chemical building blocks of polymers to microelectronics reliability
Conference paper (2004) -
HJL Bressers (author)
,
WD van Driel (author)
,
K.M.B. Jansen (author)
,
L.J. Ernst (author)
,
GQ Zhang (author)
Modeling of cure-induced warpage of plastic IC packages
Conference paper (2004) -
D Yang (author)
,
K.M.B. Jansen (author)
,
L.J. Ernst (author)
,
GQ Zhang (author)
,
WD van Driel (author)
,
HJL Bressers (author)
Fully cure-dependent polymer modeling and application to QFN-packages warpage
Conference paper (2004) -
D Yang (author)
,
L.J. Ernst (author)
,
K.M.B. Jansen (author)
,
C van t Hof (author)
,
GQ Zhang (author)
,
WD van Driel (author)
,
HJL Bressers (author)
Prediction of crack growth in IC passivation layers
Journal article (2004) -
Y He (author)
,
MAJ van Gils (author)
,
WD van Driel (author)
,
GQ Zhang (author)
,
RBR van Silfhout (author)
,
L.J. Ernst (author)
Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers
Conference paper (2004) -
D Yang (author)
,
K.M.B. Jansen (author)
,
L.J. Ernst (author)
,
GQ Zhang (author)
,
WD van Driel (author)
,
HJL Bressers (author)
,
XJ Fan (author)
The influence of leadframe on passivation cracks growth
Conference paper (2003) -
GQ Zhang (author)
,
WD van Driel (author)
,
XJ Fan (author)
,
L.J. Ernst (author)
Prediction of crack growth in IC passivation layers
Conference paper (2003) -
Y He (author)
,
GQ Zhang (author)
,
MAJ van Gils (author)
,
RBR van Silfhout (author)
,
WD van Driel (author)
,
L.J. Ernst (author)
Prediction and verification of process induced warpage of electronic packages
Journal article (2003) -
WD van Driel (author)
,
GQ Zhang (author)
,
JHJ Janssen (author)
,
L.J. Ernst (author)
,
F Su (author)
,
KS Chian (author)
,
S Yi (author)
Influence of material combinations on delamination failures in a cavity down TBGA package
Conference paper (2003) -
WD van Driel (author)
,
G. Wisse (author)
,
AYL Chang (author)
,
GQ Zhang (author)
,
L.J. Ernst (author)
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods
Conference paper (2003) -
C Liu (author)
,
GQ Zhang (author)
,
WD van Driel (author)
,
RBR van Silfhout (author)
,
MAJ van Gils (author)
,
L.J. Ernst (author)
Cracking prediction of IC's passivation layer using J-integral
Conference paper (2003) -
GQ Zhang (author)
,
WD van Driel (author)
,
XJ Fan (author)
,
L.J. Ernst (author)