WD van Driel | TU Delft Repository

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WD van Driel

Conference paper (20)

Journal article (6)

26 records found

1

Establishment of the mesoscale parameters for epoxy-copper interfacial separation

Conference paper (2012) - K.Y. Wong (author) , YY Leung (author) , R.H. Poelma (author) , Kasper Jansen (author) , CCA Yuan (author) , WD van Driel (author) , G. Zhang (author)

Advanced structural similarity rules for the BGA package family

Conference paper (2005) - WD van Driel (author) , A. Mavinkurve (author) , MAJ van Gils (author) , GQ Zhang (author) , DG Yang (author) , L.J. Ernst (author)

From chemical building blocks of polymers to microelectronics reliability

Conference paper (2004) - HJL Bressers (author) , WD van Driel (author) , Kaspar M.B. Jansen (author) , L.J. Ernst (author) , GQ Zhang (author)

Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques

Conference paper (2004) - RBR van Silfhout (author) , WD van Driel (author) , Y Li (author) , MAJ van Gils (author) , JHJ Jansen (author) , GQ Zhang (author) , G Tao (author) , J Bisschop (author) , Leo Ernst (author)

Virtual prototyping and qualification of Board Level Assembly

Conference paper (2004) - WD van Driel (author) , GQ Zhang (author) , JWC de Vries (author) , M. Jansen (author) , Leo Ernst (author)

Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

Conference paper (2004) - D Yang (author) , Kaspar M.B. Jansen (author) , Leo Ernst (author) , GQ Zhang (author) , WD van Driel (author) , HJL Bressers (author) , XJ Fan (author)

Prediction of crack growth in IC passivation layers

Journal article (2004) - Y He (author) , MAJ van Gils (author) , WD van Driel (author) , GQ Zhang (author) , RBR van Silfhout (author) , LJ Ernst (author)

Virtual qualification of moisture induced failures of advanced packages

Conference paper (2004) - MAJ van Gils (author) , WD van Driel (author) , GQ Zhang (author) , HJL Bressers (author) , RBR van Silfhout (author) , XJ Fan (author) , JHJ Jansen (author)

Modeling of cure-induced warpage of plastic IC packages

Conference paper (2004) - D Yang (author) , Kasper Jansen (author) , Leo Ernst (author) , GQ Zhang (author) , WD van Driel (author) , HJL Bressers (author)

On wire failures in micro-electronic packages

Conference paper (2004) - WD van Driel (author) , JHJ Jansen (author) , RBR van Silfhout (author) , MAJ van Gils (author) , GQ Zhang (author) , L.J. Ernst (author)

Mechanism-based delamination prediction during reflow with moisture preconditioning

Conference paper (2004) - X Fan (author) , GQ Zhang (author) , WD van Driel (author) , L.J. Ernst (author)

Prediction of thermo-mechanical integrity of wafer backend processes

Journal article (2004) - V Gonda (author) , JMJ den Toonder (author) , J Beijer (author) , GQ Zhang (author) , WD van Driel (author) , ROJM Hoofman (author) , LJ Ernst (author)

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Journal article (2004) - WD van Driel (author) , C Liu (author) , GQ Zhang (author) , JHJ Janssen (author) , RBR van Silfhout (author) , MAJ van Gils (author) , L.J. Ernst (author)

Fully cure-dependent polymer modeling and application to QFN-packages warpage

Conference paper (2004) - D Yang (author) , LJ Ernst (author) , Kaspar M B Jansen (author) , C van t Hof (author) , GQ Zhang (author) , WD van Driel (author) , HJL Bressers (author)

Response surface modeling for nonlinear packaging stresses

Journal article (2003) - WD van Driel (author) , GQ Zhang (author) , JHJ Janssen (author) , L.J. Ernst (author)

Prediction of crack growth in IC passivation layers

Conference paper (2003) - Y He (author) , GQ Zhang (author) , MAJ van Gils (author) , RBR van Silfhout (author) , WD van Driel (author) , LJ Ernst (author)

Effect of delamination of IC/compound interface on passivation cracking

Conference paper (2003) - RBR van Silfhout (author) , JD Roustant (author) , WD van Driel (author) , Y. Li (author) , GQ Zhang (author) , D Yang (author)

Influence of material combinations on delamination failures in a cavity down TBGA package

Conference paper (2003) - WD van Driel (author) , G. Wisse (author) , AYL Chang (author) , GQ Zhang (author) , L.J. Ernst (author)

The influence of leadframe on passivation cracks growth

Conference paper (2003) - GQ Zhang (author) , WD van Driel (author) , XJ Fan (author) , Leo Ernst (author)

Prediction and verification of process induced warpage of electronic packages

Journal article (2003) - WD van Driel (author) , GQ Zhang (author) , JHJ Janssen (author) , LJ Ernst (author) , F Su (author) , KS Chian (author) , S Yi (author)