Establishment of the mesoscale parameters for epoxy-copper interfacial separation

Advanced structural similarity rules for the BGA package family

Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

Prediction of thermo-mechanical integrity of wafer backend processes

Prediction of crack growth in IC passivation layers

Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques

On wire failures in micro-electronic packages

Fully cure-dependent polymer modeling and application to QFN-packages warpage

Virtual prototyping and qualification of Board Level Assembly

Virtual qualification of moisture induced failures of advanced packages

Mechanism-based delamination prediction during reflow with moisture preconditioning

From chemical building blocks of polymers to microelectronics reliability

Modeling of cure-induced warpage of plastic IC packages

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Prediction of crack growth in IC passivation layers

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Prediction and verification of process induced warpage of electronic packages

The influence of leadframe on passivation cracks growth

Cracking prediction of IC's passivation layer using J-integral

Response surface modeling for nonlinear packaging stresses