Wv

WD van Driel

View Pure Profile

Authored

20 records found

Virtual prototyping and qualification of Board Level Assembly

Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers

Prediction of crack growth in IC passivation layers

Influence of material combinations on delamination failures in a cavity down TBGA package

Response surface modeling for nonlinear packaging stresses

On wire failures in micro-electronic packages

Prediction of crack growth in IC passivation layers

Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound

Prediction and verification of process induced warpage of electronic packages

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

From chemical building blocks of polymers to microelectronics reliability

Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques

Prediction and verification of process-induced thermal deformation of electronic packages using non-linear FEM and 3D interferometry

Mechanism-based delamination prediction during reflow with moisture preconditioning
Conference paper - X Fan, GQ Zhang, WD van Driel, L.J. Ernst

Cracking prediction of IC's passivation layer using J-integral
Conference paper - GQ Zhang, WD van Driel, XJ Fan, L.J. Ernst

Virtual qualification of moisture induced failures of advanced packages

Fully cure-dependent polymer modeling and application to QFN-packages warpage

Prediction of back-end process-induced wafer warpage and experimental verification

Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods

Modeling of cure-induced warpage of plastic IC packages