26 records found
1
Establishment of the mesoscale parameters for epoxy-copper interfacial separation
Advanced structural similarity rules for the BGA package family
Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers
Virtual prototyping and qualification of Board Level Assembly
Prediction of thermo-mechanical integrity of wafer backend processes
Prediction of crack growth in IC passivation layers
On wire failures in micro-electronic packages
Mechanism-based delamination prediction during reflow with moisture preconditioning
From chemical building blocks of polymers to microelectronics reliability
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods
Fully cure-dependent polymer modeling and application to QFN-packages warpage
Effect of metal layout design on passivation crack occurrence using both experimental and simulation techniques
Virtual qualification of moisture induced failures of advanced packages
Modeling of cure-induced warpage of plastic IC packages
Packaging induced die stresses - effect of chip anisotropy and time-dependent behavior of a molding compound
Cracking prediction of IC's passivation layer using J-integral
Effect of delamination of IC/compound interface on passivation cracking
The influence of leadframe on passivation cracks growth
