Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers
Conference Paper
(2004)
Author(s)
D Yang (TU Delft - Dynamics of Micro and Nano Systems)
KMB Jansen (TU Delft - Dynamics of Micro and Nano Systems)
L.J. Ernst (TU Delft - Dynamics of Micro and Nano Systems)
GQ Zhang (External organisation)
WD van Driel (External organisation)
HJL Bressers (External organisation)
XJ Fan (External organisation)
Research Group
Dynamics of Micro and Nano Systems
To reference this document use:
https://resolver.tudelft.nl/uuid:68171dfa-3a73-4b2c-8085-4b3436a79a06
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Publication Year
2004
Research Group
Dynamics of Micro and Nano Systems
Pages (from-to)
98-105
ISBN (print)
0-7803-8365-6
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